WebApr 11, 2024 · ABSTRACT. Ultra-high-temperature ceramics are required for many aerospace applications. In this work, HfB 2-30 vol.% HfC and HfB 2-26 vol.% HfC-43 vol.% MoB high-density composites were prepared by one-step in-situ reactive spark plasma sintering (R-SPS) using Hf, B 4 C and Mo powders as starting materials. The influences of sintering … WebA novel polishing technique that combines plasma electrolytic processing and mechanical polishing (PEP-MP) was proposed in order to polish single-crystal 4H-SiC surfaces effectively, and an ultra-smooth surface is obtained and the surface roughness is decreased.
Influence of SiC surface defects on materials removal in …
WebAug 9, 2012 · For the finishing of some difficult-to-machine materials, such as silicon carbide, diamond, and so on, a novel polishing technique named plasma-assisted polishing (PAP) was proposed, which combined with the irradiation of atmospheric pressure water vapor plasma and polishing using soft abrasives. In this article, application of PAP to 4H … WebJan 1, 2011 · Plasma-assisted polishing using a CeO 2 abrasive enabled us to improve the surface roughness of a commercially available SiC wafer without introducing crystallographical subsurface damage, and a scratch-free atomically flat surface with an rms roughness of 0.1 nm level was obtained. the pub table co
Highly efficient chemical mechanical polishing method for SiC ...
Web14 hours ago · In this study, shear rheological polishing was used to polish the Si surface of six-inch 4H-SiC wafers to improve polishing efficiency. The surface roughness of the Si … WebOct 28, 2024 · Plasma Polish is a contactless method for selectively removing damaged SiC from the surface while maintaining good surface quality. Other benefits of PPDE are lower cost per wafer, less chemical and consumables usage, and better process stability and MTBC. One critical aspect to understand about what is happening at the wafer surface … Web14 hours ago · In this study, shear rheological polishing was used to polish the Si surface of six-inch 4H-SiC wafers to improve polishing efficiency. The surface roughness of the Si surface was the main evaluation index, and the material removal rate was the secondary evaluation index. An experiment was designed using the Taguchi method to analyze the … significance of elevated alk phos